Beschreibung
Mirka polishing pad 150 mm waffled
Medium hard and excellent elasticity
Technical data
- Ø 150 mm
- Thickness
25 mm
- Material
Foam, waffled
Features & benefits
- The waffle structure reduces the surface temperature during polishing.
- The foam pad is to be used in combination with Mirka Polarshine 10 polish.
- For backing pad with Ø 135 mm.
Technical data
- Ø 150 mm
- Thickness
25 mm
- Material
Foam, waffled
Rezensionen
Es gibt noch keine Rezensionen.